TE Connectivity Testsockel, LGA-Gehäuse

Mehr Infos und technische Dokumente
Rechtliche Anforderungen
RoHS Status: kompatibel (Zertifikat anzeigen)
Produktdetails

TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling. As one of a limited number of suppliers of this technology, TE is your dependable socket partner to support current and future Intel CPU processor designs.

Two-piece design for increased reliability: First LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability
Dependable partner: As new generations of chip platforms are developed, TE will offer the latest LGA sockets for your designs
APPLICATIONS
Servers
Data Centers
High Performance Computing (HPC)

Technische Daten
Eigenschaft Wert
Gehäusetyp LGA
Gehäusematerial Edelstahl
42 lieferbar innerhalb von 5 Werktagen.
Preis pro: Stück
CHF .45.519
(ohne MwSt.)
Stück
Pro Stück
1 - 4
CHF.45.519
5 - 9
CHF.43.764
10 +
CHF.40.605
Verpackungsoptionen: